Auto Cutting-Trimming System
The system is applied after pressing in both IC Substrate and PCB, combined by multiple modules in accordance to customer demand.
Functional modules, besides cutting-trimming, include chamfer and fillet, thickness measurement, X-ray drilling, letting, etc., enhancing the comprehensive capability of the system.
Functional modules, besides cutting-trimming, include chamfer and fillet, thickness measurement, X-ray drilling, letting, etc., enhancing the comprehensive capability of the system.
Product Video
Application
IC Substrate, PCB, etc.
Features
1. Market dominator, choice of leading factories in China
2. Applicable for wide range of thickness and size
3. Integral design of cutting & trimming, to create smooth edge with minimal burr
4. Waste is nicely cut and collected, minimum rate of stuck
5. Stable fillet output
Main Spec.
| Plate Thickness | 0.1mm-10mm |
| Productivity | 6 pcs/min |
| Alignment | Two cameras, high efficiency |
| Thickness Measurement | ≥ 21 spots |
